LED heat is a well-known thing in the industry, because heat will affect the light decay and life of LED. Today, we introduce a new assembly process for LED application products - the thermal path of LED conduction and heat dissipation is not glued, and it is shared with all readers!
At present, the assembly of LED application products (including materials, assembly methods and steps) is as follows:
1. Fix the LED light source (mainly SMD type SMD LED, such as Luminleds Luxeon, Cree X Lamp, etc.) on the aluminum substrate by soldering.
2. Apply the thermal paste (or use the thermal conductive silicone sheet) to the aluminum substrate and fix it on the heat sink components (mainly the heat sink fins) with screws.
Glue is a kind of polymer compound, which is usually deteriorated by many factors such as temperature, moisture, ultraviolet rays, etc., and will deteriorate with time, so as to affect its heat conduction effect.
According to the above structure and process, after the heat energy is generated from the LED die, the heat energy is continuously transmitted to the heat radiating fin, and the heat radiating fin exchanges heat with the air. The heat conduction path of the LED guiding and heat dissipating often has three layers of glue:
1, the first layer of glue: solid crystal glue;
2. The second layer of glue: a thermal conductive adhesive of copper foil and aluminum plate in the aluminum substrate;
3, the third layer of glue: aluminum substrate coated with thermal paste (or use thermal silica gel).
Figure 1 General conduction and heat dissipation structure
Solid crystal glue
In the LED package on the market, the crystal grain is mostly bonded to the support (or the solid crystal substrate, the solid crystal substrate) by the solid crystal glue. Regardless of whether the solid crystal adhesive is made of conductive adhesive or non-conductive adhesive (also known as insulating adhesive), it has the characteristics of glue and glue.
In order to improve the thermal conductivity of the package, some companies have changed the eutectic process to replace the solid-state adhesive process, such as Cree, and some packagers have replaced the die-bonding process with solder paste through the reflow process. The above two, whether it is a eutectic process, or a solder paste reflow process to replace the solid crystal glue process, is to avoid the use of glue.
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