Sumitomo Osaka Cement develops epoxy resin suitable for LED lighting

Recently, Sumitomo Osaka Cement and Japan's Lee Chang Industrial jointly developed the liquid epoxy resin "Rico Zi-ma inus", which greatly improves the thermal conductivity while ensuring electrical insulation. The thermal conductivity is at most 7.3 W/m·K, which is about 40 times higher than that of the general-purpose epoxy resin. According to reports, the heat dissipation characteristics are close to metal oxides, and can be used for heat dissipating components such as LED lighting fixtures, motors, and power supply devices.
The product is used in a "1 liquid type" in which the main material and the hardening material are mixed in a ratio of 1 to 1 to cause thermal hardening, and a "1 liquid type" in which the main material and the thermosetting material have been mixed. As a standard, the two-liquid type has four types of thermal conductivity of 1, 2, 4, and 7 W/m·K, and the one-liquid type has three types of thermal conductivity of 1, 2, and 4 W/m·K. The products developed this time have a specific resistance of up to 1013 Ω·cm or more, ensuring electrical insulation. The viscosity at 75 ° C or higher is less than 15 Pa·s. Since it is required to be thermally hardened by heat treatment at a temperature of 120 to 130 ° C for several hours, it has sufficient fluidity during molding.
In order to achieve the above three characteristics at the same time, the company has mixed a metal oxide filler having high electrical insulation and high thermal conductivity in the epoxy resin. This filler adds other metal oxides as a crosslinking agent to alumina particles having a thermal conductivity of up to 20 W/m·K and bonds them together.
The metal oxide filler is added in an amount of 75% to 90% of the total weight. Recently, Sumitomo Osaka Cement and Japan Lichang Industrial jointly developed a liquid epoxy resin "Rico Zi-ma inus", which ensures electrical insulation. At the same time, the thermal conductivity is greatly improved. The thermal conductivity is at most 7.3 W/m·K, which is about 40 times higher than that of the general-purpose epoxy resin. According to reports, the heat dissipation characteristics are close to metal oxides, and can be used for heat dissipating components such as LED lighting fixtures, motors, and power supply devices.
The product is used in a "1 liquid type" in which the main material and the hardening material are mixed in a ratio of 1 to 1 to cause thermal hardening, and a "1 liquid type" in which the main material and the thermosetting material have been mixed. As a standard, the two-liquid type has four types of thermal conductivity of 1, 2, 4, and 7 W/m·K, and the one-liquid type has three types of thermal conductivity of 1, 2, and 4 W/m·K. The products developed this time have a specific resistance of up to 1013 Ω·cm or more, ensuring electrical insulation. The viscosity at 75 ° C or higher is less than 15 Pa·s. Since it is required to be thermally hardened by heat treatment at a temperature of 120 to 130 ° C for several hours, it has sufficient fluidity during molding.
In order to achieve the above three characteristics at the same time, the company has mixed a metal oxide filler having high electrical insulation and high thermal conductivity in the epoxy resin. This filler adds other metal oxides as a crosslinking agent to alumina particles having a thermal conductivity of up to 20 W/m·K and bonds them together.
The metal oxide filler is added in an amount of 75% to 90% by weight, which accounts for more than half of the weight of the product developed this time. Ordinary epoxy resins have higher viscosity and moldability gradually deteriorates. As a result, the company has developed epoxy resins and mixing processes that do not increase viscosity when mixing metal oxide fillers. However, the technical details cannot be disclosed now. It accounts for more than half of the weight of the products developed this time. Ordinary epoxy resins have higher viscosity and moldability gradually deteriorates. As a result, the company has developed epoxy resins and mixing processes that do not increase viscosity when mixing metal oxide fillers. However, the technical details cannot be disclosed now.

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