The 2016 Gaogong LED Annual Meeting·Golden Ball Awards Ceremony and the 10th Anniversary Celebration of High-tech Production and Research will be held on January 5-6, 2017 at the Venus Royal Hotel in Shajing, Shenzhen.
This high-tech LED annual meeting will once again bring together domestic and foreign business leaders, analyze the overall industrial opportunities and risks, and comprehensively look forward to the trend of technology, market, capital, and other aspects to jointly solve the Chinese and global LEDs in 2016-2018. The "winning" way of the lighting industry.
2016 is a magnificent year. From the beginning of the year, LED chips, brackets, raw materials and midstream packaging giants have raised prices, which undoubtedly shows that the LED industry will return to rationality and health.
As a company of LED packaging equipment--Taiwan Technology, from the beginning of its establishment, it has always been driven by innovation, market-oriented, environmental protection and energy conservation. Now, after six years of precipitation, it has gradually entered the forefront of LED packaging equipment companies.
Zhu Fengmeng, chairman of Taiwan Industrial Technology, said, "With the full competition and development of the LED market, the demand for products has gradually returned from price to quality. More and more customers are pursuing high quality and cost-effective products. â€
To this end, how to ensure the quality of the product is very important, Zhu Fengmeng believes that "strictly control the design and manufacturing of the two links, product quality can be guaranteed, the quality of product manufacturing itself is the key to product quality."
As far as the flip-chip market is concerned, it is undeniable that it is the trend of the times, and with the continuous advancement of related technologies, the cost of components is very close to the formal dress (the price difference is less than 10%). In order to cope with the new market changes, Taiwan Engineering Technology In June 2016, the company cooperated with the Japanese partner to develop a new generation of flip-chip bonding equipment - LEP Main Bonder For LEP.
The latest products produced by this equipment have greater advantages than the current reflow soldering products, mainly reflected in: first, to solve the hidden dangers in the production process; second, reduce the cost of flip chip, simplify the process Process; third, the operation is simpler, so that the operator is more comfortable; fourth, improve product yield.
In addition, the connecting rod positioning mechanism equipment independently developed by Taigong Technology for automatic high-speed LED packaging machine is also very successful. The invention technology has subverted the field of LED braiding, and the original 36K/H capacity has been directly increased to 50K/. H. Solved the traditional problem of not allowing the incoming cassettes in the early stage of the industry, allowing customers to directly increase profits and save manufacturing costs such as site and labor.
Only the company has its own "black" technology, plus equipment quality assurance, a good and perfect after-sales service system, and the market prospect is still very large.
Reshuffle, integration, and capital will continue to be the main theme of the industry in the next three years. Focusing on segmentation, expansion, and cross-border is the way out for LED companies.
Taiwanese technology is in full swing, Zhu Fengmeng said, "On the basis of consolidating the main business of LED spectroscopic tape, it will gradually enter new energy industries such as IC, lithium battery, robot and other emerging industries. In the near future, this It will also be our focus on the market."
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