LED packaging equipment from semi-automatic to automated intelligent will become a new air outlet

As of the end of 2016, the reshuffle of the packaging equipment market has basically come to an end, and various subdivisions have also established "giants".

At present, the market concentration of LED packaging equipment has increased year by year, and many small and medium-sized enterprises have withdrawn from the market. However, the rapid development of the LED packaging industry has become more and more demanding for existing packaging equipment companies.

High-tech Research Institute LED Research Institute (GGII) I believes that LED packaging equipment companies can only continue to survive in the future market by keeping up with LED packaging companies and constantly breaking through existing technology bottlenecks.

Indeed, after decades of rapid development in the LED industry, existing technologies and manufacturing models have been unable to meet the needs of industry development. Factors such as labor shortages and rising costs, overcapacity, individualized market demand, and rapid updates in technology and products require changes in the existing LED industry model.

Specifically, the LED lighting market has experienced a shift from replacement lamps to integrated LEDs and next-generation smart lighting applications, and is currently in a transitional phase. At the same time, the LED packaging industry is also in a transitional phase from non-standardization to a variety of PLCC standardization and high-density packaging, and new technologies represented by COB/CSP.

The lighting market is changing, the packaging market is also changing, and the packaging equipment market will also change in response to changes in the packaging market. So, in which direction will the packaging equipment market change in 2017, and what do the representatives of these companies say?

Zhao Shutao, Chairman of Hyun Shuo Optoelectronics

At present, LED packaging equipment is shifting from semi-automation to automation, and finally moving towards intelligence.

With the upgrade of LED technology and quality, higher requirements will be placed on packaging equipment. Now the LED packaging industry has undergone tremendous changes, and global packaging capacity is shifting to China.

Of course, the continuous innovation and segmentation of LED products will bring more opportunities to the packaging equipment industry.

Nowadays, the LED lighting market is developing towards the direction of intelligence. LED equipment companies should carry out strategic cooperation with customers to accelerate the optimization and upgrading of intelligent equipment, and gradually realize the replacement of traditional production lines by intelligent production lines.

It is believed that LED packaging equipment and lighting automation equipment industry will usher in a new round of opportunities in 2017. In this regard, Hyun Shuo Optoelectronics established the Optical Tape Division, Non-standard Automation Division, Intelligent Equipment Division, and Lithium Battery Automation. Equipment Division.

In addition, Hyun Shuo Optoelectronics also set up a number of professional R & D team, set up offices throughout the country to provide timely after-sales service, and ultimately the company into an industrial automation, intelligent total solution provider.

Zhu Fengmeng, Chairman of Taiwan Industrial Technology

After nearly two years of market reshuffle, the packaging equipment capacity will be more concentrated in the hands of several large packaging manufacturers in 2017, and the market share of RGB will become larger and larger.

As the cost of raw materials rises and labor costs increase, in order to reduce costs for packaging manufacturers as much as possible, Taigong Technology strives to create smart devices to intelligentize production processes and packaging processes, thereby increasing production efficiency, reducing labor costs, and further reducing The gap in price increases.

Regarding smart devices, in fact, as early as 2016, Taiwan Tech has begun to make layouts.

As a fist product of Taiwan Industrial Technology, the spectroscope will continue to exert its strength in this field this year. Of course, as packaging materials become smaller and smaller, the accuracy requirements of the packaged products for the beam splitter will become higher and higher.

In 2017, the focus of Taigong Technology's product layout is the two directions of splitter and smart device. In addition, this year will also follow the footsteps of Guoxing Optoelectronics, Jingtai Co., and Cinda, and be optimistic about the small-pitch market and make layouts.

It is expected that the entire LED market will be relatively optimistic in 2017, as the reshuffle has been finalized.

Song Changning, general manager of Xinyichang

In the past two years, domestic equipment manufacturers have gradually emerged in the equipment market, and their market share has also been greatly improved.

In 2017, with the improvement of technology and equipment stability in packaging and packaging equipment enterprises, the market share of domestic equipment manufacturers will also be greatly improved. Next, the development direction of the entire equipment market will continue the trend of last year, and will not change much.

As the key layout area of ​​Xinyichang, the solid crystal machine is constantly upgrading as the market demand changes. In the future, the chip requires more and more compact size, so the die bonder is also required to have higher precision.

It is expected that the demand for the solid crystal market this year will be similar to last year. In this regard, Xinyichang will also diversify on the basis of strengthening the existing solid crystal market.

At present, the market has stabilized, and we will also make the solid crystal equipment more humanized and more refined. At the same time, prepare for the newly injected equipment of the emerging industry in the future.


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